File Name: hot air rises and heat sinks .zip
Convection is the transfer of heat due to the bulk movement of molecules within fluids gases and liquids , including molten rock rheid. Convection includes sub-mechanisms of advection directional bulk-flow transfer of heat , and diffusion non-directional transfer of energy or mass particles along a concentration gradient. Convection cannot take place in most solids because neither bulk current flows nor significant diffusion of matter can take place.
- Hot Air Rises and Heat Sinks
- Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong Tony Kordyban
- Hot air rises and heat sinks : everything you know about cooling electronics is wrong (1998)
You have to Login for download or view attachment s.
Goodreads helps you keep track of books you want to read. Want to Read saving…. Want to Read Currently Reading Read. Other editions.
Hot Air Rises and Heat Sinks
Skip to search form Skip to main content You are currently offline. Some features of the site may not work correctly. DOI: Rafanelli Published Engineering. Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong is a collection of myths, mistakes, and "lessons learned" from practicing engineers involved in the field of electronic equipment cooling. Through anecdotes and stories based on his experiences at Tellabs Operations, Inc. Tony Kordyban covers basic dimensions of heat transfer concepts-mostly from real problems which were incorrectly solved at least once before a correct technique was applied.
You've discovered a title that's missing from our library. Can you help donate a copy? Open Library is a project of the Internet Archive , a c 3 non-profit. We don't have this book yet. Can you donate it to the Lending Library?
Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong Tony Kordyban
A heat sink also commonly spelled heatsink  is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes LEDs , where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.
By Tony Kordyban. Ifirst met Herbie in my early days at TeleLeap, Inc. The name TeleLeap comes from the idea that we leapfrog current technology to develop new telecommunications products. Some say it comes from our habit of releasing a new product every leap year. It was that awkward time between learning where the bathrooms were and actually having some work to do. The first job that falls on your desk, and the way you handle it, sets the tone for how the rest of them will go.
Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong is a collection of myths, mistakes, and "lessons learned" from practicing.
Hot air rises and heat sinks : everything you know about cooling electronics is wrong (1998)
Through anecdotes and stories based on his experiences at Tellabs Operations, Inc. Tony Kordyban covers basic dimensions of heat transfer concepts—mostly from real problems which were incorrectly solved at least once before a correct technique was applied. The book's 31 chapters, each on an important and relevant topic, contain simple line drawings to help illustrate the basic concepts, while the text provides accurate and complete technical explanations. The book's case study approach makes it an extremely useful and handy reference—and Kordyban's clear and entertaining writing style mixes technical subject matter with humor and is both interesting and instructive.